An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate

High-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for three-dimensional integration of on-chip antennas in wafer-level chip-scale packages (WLCSP). Sandwiching of HRPS and silicon wafers enables to integrate complex RF passives with a spacing of >150 µm to...

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Detalhes bibliográficos
Autor principal: Mendes, P. M. (author)
Outros Autores: Polyakov, A. (author), Bartek, M. (author), Burghartz, J. N. (author), Correia, J. H. (author)
Formato: conferencePaper
Idioma:eng
Publicado em: 2004
Assuntos:
Integrated antenna
Folded antenna
Small antenna
Wireless microsystem
Science & Technology
Texto completo:http://hdl.handle.net/1822/1619
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/1619

Texto Completo

http://hdl.handle.net/1822/1619

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