Rheology characterization of a solder paste

Reflow soldering process is widely implemented in the electronics industry. This method allows the attachment of electronic components to a printed circuit board (PCB) through the melting of solder paste, which makes the interconnection between them. The reflow soldering process must ensures the cor...

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Bibliographic Details
Main Author: Barbosa, Flávia Vieira (author)
Other Authors: Ribeiro, Pedro Emanuel Abreu (author), Cerqueira, M. F. (author), Soares, Delfim (author), Teixeira, J. Carlos (author), Teixeira, S. F. C. F. (author), Lima, Rui Alberto Madeira Macedo (author), Pinho, Diana (author)
Format: conferencePaper
Language:eng
Published: 2018
Subjects:
Solder paste
rheology
Printing process
Viscoelasticity
Thixotropy
Viscoelastic
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Online Access:http://hdl.handle.net/1822/53395
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/53395

Internet

http://hdl.handle.net/1822/53395

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