Rheology characterization of a solder paste

Reflow soldering process is widely implemented in the electronics industry. This method allows the attachment of electronic components to a printed circuit board (PCB) through the melting of solder paste, which makes the interconnection between them. The reflow soldering process must ensures the cor...

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Detalhes bibliográficos
Autor principal: Barbosa, Flávia Vieira (author)
Outros Autores: Ribeiro, Pedro Emanuel Abreu (author), Cerqueira, M. F. (author), Soares, Delfim (author), Teixeira, J. Carlos (author), Teixeira, S. F. C. F. (author), Lima, Rui Alberto Madeira Macedo (author), Pinho, Diana (author)
Formato: conferencePaper
Idioma:eng
Publicado em: 2018
Assuntos:
Solder paste
rheology
Printing process
Viscoelasticity
Thixotropy
Viscoelastic
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Texto completo:http://hdl.handle.net/1822/53395
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/53395

Texto Completo

http://hdl.handle.net/1822/53395

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