Contact angle measurement of SAC 305 solder: numerical and experimental approach

The solder process comprises the ability of a melted alloy to flow or spread on a substrate for the formation of a metallic bond driven by the physical–chemical properties of the system. Thus, the study of wetting behaviour is an important step in the characterisation of solder alloys and requires t...

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Bibliographic Details
Main Author: Rodrigues, Nelson Ricardo Pereira (author)
Other Authors: Ferreira, Ana C. M. (author), Teixeira, S. F. C. F. (author), Cerqueira, M. F. (author), Macedo, Francisco (author), Soares, Delfim (author), Teixeira, J. Carlos (author)
Format: article
Language:eng
Published: 2016
Subjects:
SAC 305 Solder
Contact Angle
Surface Tension
Computational Fluid Dynamics (CFD)
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Online Access:http://hdl.handle.net/1822/53435
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/53435

Internet

http://hdl.handle.net/1822/53435

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