Contact angle measurement of SAC 305 solder: numerical and experimental approach

The solder process comprises the ability of a melted alloy to flow or spread on a substrate for the formation of a metallic bond driven by the physical–chemical properties of the system. Thus, the study of wetting behaviour is an important step in the characterisation of solder alloys and requires t...

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Detalhes bibliográficos
Autor principal: Rodrigues, Nelson Ricardo Pereira (author)
Outros Autores: Ferreira, Ana C. M. (author), Teixeira, S. F. C. F. (author), Cerqueira, M. F. (author), Macedo, Francisco (author), Soares, Delfim (author), Teixeira, J. Carlos (author)
Formato: article
Idioma:eng
Publicado em: 2016
Assuntos:
SAC 305 Solder
Contact Angle
Surface Tension
Computational Fluid Dynamics (CFD)
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Texto completo:http://hdl.handle.net/1822/53435
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/53435

Texto Completo

http://hdl.handle.net/1822/53435

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