Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the s...

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Bibliographic Details
Main Author: Soares, Delfim (author)
Other Authors: Vilarinho, Cândida (author), Barbosa, J. (author), Samuel, Filipe (author), Trigo, Luisa (author), Bré, Paulo (author)
Format: article
Language:eng
Published: 2007
Subjects:
Lead-free
Electronics
solder
interface
reaction
Science & Technology
Online Access:http://hdl.handle.net/1822/14392
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/14392

Internet

http://hdl.handle.net/1822/14392

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