Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations

This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and...

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Bibliographic Details
Main Author: Mendes, P. M. (author)
Other Authors: Polyakov, A. (author), Bartek, M. (author), Burghartz, J. N. (author), Correia, J. H. (author)
Format: article
Language:eng
Published: 2006
Subjects:
Chip-size antenna
Wireless microsystem
Wafer-level packaging
Excimer laser ablation
Via fabrication
water-level packaging
wireless inicrosystein
Science & Technology
Online Access:http://hdl.handle.net/1822/5939
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/5939

Internet

http://hdl.handle.net/1822/5939

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