Influence of the microstructure on the creep behaviour of Tin-Silver-Copper solder

A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of...

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Bibliographic Details
Main Author: Ribeiro, Pedro Emanuel Abreu (author)
Other Authors: Soares, Delfim (author), Cerqueira, M. F. (author), Teixeira, S. F. C. F. (author), Barros, Daniel Araújo (author), Teixeira, J. Carlos (author), Capela, Paulina Araújo (author), Macedo, Francisco (author)
Format: conferencePaper
Language:eng
Published: 2018
Subjects:
SAC solder
microstructure
Creep
Solder reliability
Solder mechanical properties
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Online Access:http://hdl.handle.net/1822/71714
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/71714

Internet

http://hdl.handle.net/1822/71714

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