Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder
Because of environmental and health concerns, some alternative solder alloys, named lead-free ones, are being developed. Among them, the Sn-Zn-Al system has been studied and reveals promising properties. In this work the presence of bismuth, in the range of 0 - 8 wt%, was evaluated in what concerns...
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| Outros Autores: | , , , |
| Formato: | article |
| Idioma: | eng |
| Publicado em: |
2005
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| Assuntos: | |
| Texto completo: | http://hdl.handle.net/1822/12418 |
| País: | Portugal |
| Oai: | oai:repositorium.sdum.uminho.pt:1822/12418 |