Mixed carbon nanomaterial/epoxy resin for electrically conductive adhesives

The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial...

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Detalhes bibliográficos
Autor principal: Lopes, Paulo Estevão Caldeira (author)
Outros Autores: Moura, Duarte (author), Hilliou, L. (author), Krause, Beate (author), Pötschke, Petra (author), Figueiredo, Hugo (author), Alves, Ricardo (author), Lepleux, Emmanuel (author), Pacheco, Louis (author), Paiva, M. C. (author)
Formato: article
Idioma:eng
Publicado em: 2020
Assuntos:
Texto completo:http://hdl.handle.net/1822/67195
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/67195