Effect of the soldering atmosphere on the wettability between Sn4.0Ag0.5Cu (in wt.%) lead-free solder paste and various substrates
The ‘‘degree of wetting,’’ which is related to the contact angle (h) between the molten solder and the substrate, is a useful parameter on the solderability process control. The contact angle, however, is strongly dependent on the type of substrate surface finish and used atmosphere (inert or non-in...
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| Outros Autores: | , , , , , , , |
| Formato: | article |
| Idioma: | eng |
| Publicado em: |
2018
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| Assuntos: | |
| Texto completo: | http://hdl.handle.net/1822/71715 |
| País: | Portugal |
| Oai: | oai:repositorium.sdum.uminho.pt:1822/71715 |