Effect of the soldering atmosphere on the wettability between Sn4.0Ag0.5Cu (in wt.%) lead-free solder paste and various substrates

The ‘‘degree of wetting,’’ which is related to the contact angle (h) between the molten solder and the substrate, is a useful parameter on the solderability process control. The contact angle, however, is strongly dependent on the type of substrate surface finish and used atmosphere (inert or non-in...

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Bibliographic Details
Main Author: Soares, Delfim (author)
Other Authors: Leitão, H. (author), Lau, C. S. (author), Teixeira, J. Carlos (author), Ribas, L. (author), Alves, R. (author), Teixeira, S. F. C. F. (author), Cerqueira, M. F. (author), Macedo, Francisco (author)
Format: article
Language:eng
Published: 2018
Subjects:
Atmosphere
Pb-free solders
Surface finishing
Wettability
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Online Access:http://hdl.handle.net/1822/71715
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/71715

Internet

http://hdl.handle.net/1822/71715

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