Nanostructured Ti1-xCux thin films with tailored electrical and morphological anisotropy

Inclined, zigzag and spiral Ti1-xCux films were co-sputtered by the Glancing Angle Deposition technique. Two distinct titanium (Ti) and copper (Cu) targets were used and the films were grown with a particle flow incidence angle α of 80°. The thin films had Cu contents ranging from 36 to 76 ± 5 at. %...

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Detalhes bibliográficos
Autor principal: Ferreira, Armando José Barros (author)
Outros Autores: Pedrosa, Paulo (author), Martin, Nicolas (author), Yazdic, Mohammad Arab Pour (author), Billard, Alan (author), Lanceros-Méndez, S. (author), Vaz, F. (author)
Formato: article
Idioma:eng
Publicado em: 2019
Assuntos:
Electrical anisotropy
Nanostructured thin films
Titanium
Copper
Glancing Angle Deposition
Temperature Coefficient of Resistance
Engenharia e Tecnologia::Engenharia dos Materiais
Science & Technology
Texto completo:https://hdl.handle.net/1822/60717
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/60717

Texto Completo

https://hdl.handle.net/1822/60717

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