Rheology of F620 solder paste and flux

Purpose The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of the solder paste. The data obtained experimentally are fundamental for the development of numerical models that...

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Bibliographic Details
Main Author: Barbosa, Flávia Vieira (author)
Other Authors: Teixeira, José (author), Teixeira, Senhorinha F.C.F. (author), Lima, Rui Alberto Madeira Macedo (author), Soares, Delfim (author), Pinho, Diana (author)
Format: article
Language:eng
Published: 2019
Subjects:
Rheology
Flux
Solder paste
Viscosity
Thixotropy
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Online Access:http://hdl.handle.net/1822/73846
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/73846

Internet

http://hdl.handle.net/1822/73846

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