Study of the interface reactions between two lead-free solders and copper substrates
Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn- Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the...
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| Other Authors: | , , , |
| Format: | conferencePaper |
| Language: | eng |
| Published: |
2004
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| Subjects: | |
| Online Access: | http://hdl.handle.net/1822/2334 |
| Country: | Portugal |
| Oai: | oai:repositorium.sdum.uminho.pt:1822/2334 |