DMAIC methodology to solder paste printing process in Printed Circuit Boards

Nowadays, production of defective items is a crucial issue for manufacturers. In repetitive and mature processes with low defect levels, measured by defects per million opportunities (DPMO), it is difficult to reduce them even further. The purpose of this study is to reduce the defects rate in one k...

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Bibliographic Details
Main Author: Sezgin, Beyza Nur (author)
Other Authors: Sousa, Sérgio (author), Nunes, Eusébio P. (author), Alaykıran, Kemal (author)
Format: article
Language:eng
Published: 2017
Subjects:
DMAIC
Six Sigma
Surface Mount Technology - Printing Process
Engenharia e Tecnologia::Outras Engenharias e Tecnologias
Online Access:http://hdl.handle.net/1822/51963
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/51963

Internet

http://hdl.handle.net/1822/51963

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