Creep behavior of a solder paste with BI addition

A common failure mode of electronic PCB’s is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB ass...

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Detalhes bibliográficos
Autor principal: Ribeiro, Pedro Emanuel Abreu (author)
Outros Autores: Soares, Delfim (author), Cerqueira, M. F. (author), Teixeira, S. F. C. F. (author), Barros, Daniel Araújo (author), Teixeira, J. Carlos (author)
Formato: conferencePaper
Idioma:eng
Publicado em: 2018
Assuntos:
SAC solder
Bismuth
Creep
Solder reliability
Solder mechanical properties
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Texto completo:http://hdl.handle.net/1822/53400
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/53400

Texto Completo

http://hdl.handle.net/1822/53400

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