Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves

Ultrasonic-assisted soldering, as a type of new welding method, is widely used in the field of electronic packaging. This research used the immersion method to study the dissolution behavior of copper in liquid tin and the growth of IMC at 513, 543, and 573 K with/without ultrasonic waves. The amoun...

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Bibliographic Details
Main Author: Sun,Xuemin (author)
Other Authors: Yu,Weiyuan (author), Wu,Baolei (author), Yang,Guoqing (author)
Format: article
Language:eng
Published: 2020
Subjects:
Ultrasonic wave
Dissolution rate
Activation energy
Ultrasonic power
Online Access:http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224
Country:Brazil
Oai:oai:scielo:S1516-14392020000100224

Internet

http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224

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