Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
Ultrasonic-assisted soldering, as a type of new welding method, is widely used in the field of electronic packaging. This research used the immersion method to study the dissolution behavior of copper in liquid tin and the growth of IMC at 513, 543, and 573 K with/without ultrasonic waves. The amoun...
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| Outros Autores: | , , |
| Formato: | article |
| Idioma: | eng |
| Publicado em: |
2020
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| Assuntos: | |
| Texto completo: | http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224 |
| País: | Brasil |
| Oai: | oai:scielo:S1516-14392020000100224 |