Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys

Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.5Sb-1Ag and Sn-5.5Sb-1Cu alloys to...

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Bibliographic Details
Main Author: Dias, Marcelino (author)
Other Authors: Costa, Thiago A. (author), Soares, Thiago (author), Silva, Bismarck Luiz (author), Cheung, Noé (author), Spinelli, José Eduardo (author), Garcia, Amauri (author)
Format: article
Language:eng
Published: 2021
Subjects:
Sn-Sb-X alloys
Solders
Directional solidification
Microstructure
Wettability
Tensile properties
Online Access:https://doi.org/DIAS, Marcelino; COSTA, Thiago A.; SOARES, Thiago; SILVA, Bismarck L.; CHEUNG, Noé; SPINELLI, José E.; GARCIA, Amauri. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. Journal of Electronic Materials, [S.L.], v. 47, n. 2, p. 1647-1657, 12 out. 2017. Disponível em: https://link.springer.com/article/10.1007%2Fs11664-017-5837-6. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1007/s11664-017-5837-6
https://doi.org/10.1007/s11664-017-5837-6
Country:Brazil
Oai:oai:https://repositorio.ufrn.br:123456789/31738

Internet

https://doi.org/DIAS, Marcelino; COSTA, Thiago A.; SOARES, Thiago; SILVA, Bismarck L.; CHEUNG, Noé; SPINELLI, José E.; GARCIA, Amauri. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. Journal of Electronic Materials, [S.L.], v. 47, n. 2, p. 1647-1657, 12 out. 2017. Disponível em: https://link.springer.com/article/10.1007%2Fs11664-017-5837-6. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1007/s11664-017-5837-6
https://doi.org/10.1007/s11664-017-5837-6

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