Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys

Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.5Sb-1Ag and Sn-5.5Sb-1Cu alloys to...

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Detalhes bibliográficos
Autor principal: Dias, Marcelino (author)
Outros Autores: Costa, Thiago A. (author), Soares, Thiago (author), Silva, Bismarck Luiz (author), Cheung, Noé (author), Spinelli, José Eduardo (author), Garcia, Amauri (author)
Formato: article
Idioma:eng
Publicado em: 2021
Assuntos:
Sn-Sb-X alloys
Solders
Directional solidification
Microstructure
Wettability
Tensile properties
Texto completo:https://doi.org/DIAS, Marcelino; COSTA, Thiago A.; SOARES, Thiago; SILVA, Bismarck L.; CHEUNG, Noé; SPINELLI, José E.; GARCIA, Amauri. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. Journal of Electronic Materials, [S.L.], v. 47, n. 2, p. 1647-1657, 12 out. 2017. Disponível em: https://link.springer.com/article/10.1007%2Fs11664-017-5837-6. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1007/s11664-017-5837-6
https://doi.org/10.1007/s11664-017-5837-6
País:Brasil
Oai:oai:https://repositorio.ufrn.br:123456789/31738

Texto Completo

https://doi.org/DIAS, Marcelino; COSTA, Thiago A.; SOARES, Thiago; SILVA, Bismarck L.; CHEUNG, Noé; SPINELLI, José E.; GARCIA, Amauri. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. Journal of Electronic Materials, [S.L.], v. 47, n. 2, p. 1647-1657, 12 out. 2017. Disponível em: https://link.springer.com/article/10.1007%2Fs11664-017-5837-6. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1007/s11664-017-5837-6
https://doi.org/10.1007/s11664-017-5837-6

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