Interactions of Cu substrates with titanium-alloyed Sn-Zn solders
The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consiste...
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| Outros Autores: | , |
| Formato: | article |
| Idioma: | eng |
| Publicado em: |
2006
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| Assuntos: | |
| Texto completo: | http://hdl.handle.net/1822/14389 |
| País: | Portugal |
| Oai: | oai:repositorium.sdum.uminho.pt:1822/14389 |