Influence of the applied load on the creep behaviour of tin-silver-copper solder

During the life cycle of an electronic printed circuit boards (PCBs), the cold solder joints formation between the component and PCB are a failure mode that happen commonly. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal exp...

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Bibliographic Details
Main Author: Soares, Delfim (author)
Other Authors: Ribeiro, Pedro E. (author), Capela, Pauline (author), Barros, Daniel A. (author), Cerqueira, M. F. (author), Teixeira, S. F. C. F. (author), Macedo, Francisco (author), Teixeira, J. Carlos (author)
Format: conferencePaper
Language:eng
Published: 2020
Subjects:
SAC solder
Creep
applied load
Solder reliability
Science & Technology
Online Access:http://hdl.handle.net/1822/72028
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/72028

Internet

http://hdl.handle.net/1822/72028

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