Influence of the applied load on the creep behaviour of tin-silver-copper solder

During the life cycle of an electronic printed circuit boards (PCBs), the cold solder joints formation between the component and PCB are a failure mode that happen commonly. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal exp...

ver descrição completa

Detalhes bibliográficos
Autor principal: Soares, Delfim (author)
Outros Autores: Ribeiro, Pedro E. (author), Capela, Pauline (author), Barros, Daniel A. (author), Cerqueira, M. F. (author), Teixeira, S. F. C. F. (author), Macedo, Francisco (author), Teixeira, J. Carlos (author)
Formato: conferencePaper
Idioma:eng
Publicado em: 2020
Assuntos:
SAC solder
Creep
applied load
Solder reliability
Science & Technology
Texto completo:http://hdl.handle.net/1822/72028
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/72028

Texto Completo

http://hdl.handle.net/1822/72028

Registros relacionados