APA (7th ed.) Citation

Soares, D., Ribeiro, P. E., Capela, P., Barros, D. A., Cerqueira, M. F., Teixeira, S. F. C. F., . . . Teixeira, J. C. (2020). Influence of the applied load on the creep behaviour of tin-silver-copper solder.

Chicago Style (17th ed.) Citation

Soares, Delfim, Pedro E. Ribeiro, Pauline Capela, Daniel A. Barros, M. F. Cerqueira, S. F. C. F. Teixeira, Francisco Macedo, and J. Carlos Teixeira. Influence of the Applied Load on the Creep Behaviour of Tin-silver-copper Solder. 2020.

MLA (8th ed.) Citation

Soares, Delfim, et al. Influence of the Applied Load on the Creep Behaviour of Tin-silver-copper Solder. 2020.