Rheologically assisted design of conductive adhesives for stencil printing on PCB

Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives pre...

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Detalhes bibliográficos
Autor principal: Silva, Ângelo D. M. (author)
Outros Autores: Silva, Mariana M. (author), Figueiredo, Hugo (author), Delgado, Isabel (author), Lopes, Paulo E. (author), Paiva, Maria C. (author), Hilliou, L. (author)
Formato: article
Idioma:eng
Publicado em: 2021
Assuntos:
Solder paste
Electrically conductive adhesives
Carbon nanotubes
Exfoliated graphite
Stencil printing
Yield stress
Printed circuit boards
Rheology
Engenharia e Tecnologia::Engenharia dos Materiais
Science & Technology
Texto completo:https://hdl.handle.net/1822/77279
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/77279

Texto Completo

https://hdl.handle.net/1822/77279

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