Influence of the microstructure on the creep behaviour of Tin-Silver-Copper solder

A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of...

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Detalhes bibliográficos
Autor principal: Ribeiro, Pedro Emanuel Abreu (author)
Outros Autores: Soares, Delfim (author), Cerqueira, M. F. (author), Teixeira, S. F. C. F. (author), Barros, Daniel Araújo (author), Teixeira, J. Carlos (author), Capela, Paulina Araújo (author), Macedo, Francisco (author)
Formato: conferencePaper
Idioma:eng
Publicado em: 2018
Assuntos:
SAC solder
microstructure
Creep
Solder reliability
Solder mechanical properties
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Texto completo:http://hdl.handle.net/1822/71714
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/71714

Texto Completo

http://hdl.handle.net/1822/71714

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