APA (7th ed.) Citation

Ribeiro, P. E. A., Soares, D., Cerqueira, M. F., Teixeira, S. F. C. F., Barros, D. A., Teixeira, J. C., . . . Macedo, F. (2018). Influence of the microstructure on the creep behaviour of Tin-Silver-Copper solder.

Chicago Style (17th ed.) Citation

Ribeiro, Pedro Emanuel Abreu, Delfim Soares, M. F. Cerqueira, S. F. C. F. Teixeira, Daniel Araújo Barros, J. Carlos Teixeira, Paulina Araújo Capela, and Francisco Macedo. Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder. 2018.

MLA (8th ed.) Citation

Ribeiro, Pedro Emanuel Abreu, et al. Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder. 2018.