Mixed carbon nanomaterial/epoxy resin for electrically conductive adhesives

The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial...

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Bibliographic Details
Main Author: Lopes, Paulo Estevão Caldeira (author)
Other Authors: Moura, Duarte (author), Hilliou, L. (author), Krause, Beate (author), Pötschke, Petra (author), Figueiredo, Hugo (author), Alves, Ricardo (author), Lepleux, Emmanuel (author), Pacheco, Louis (author), Paiva, M. C. (author)
Format: article
Language:eng
Published: 2020
Subjects:
ECA electrically
conductive adhesive
carbon nanotubes
exfoliated graphite
electronic packaging
epoxy
ECA electrically conductive adhesive
Science & Technology
Online Access:http://hdl.handle.net/1822/67195
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/67195

Internet

http://hdl.handle.net/1822/67195

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