Integrated chip-size antenna for wireless microsystems : fabrication and design considerations

This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consist...

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Bibliographic Details
Main Author: Mendes, P. M. (author)
Other Authors: Polyakov, A. (author), Bartek, M. (author), Burghartz, J. N. (author), Correia, J. H. (author)
Format: conferencePaper
Language:eng
Published: 2003
Subjects:
Chip-size antenna
Wafer level packaging
Wireless microsystem
Laser ablation
Powder blasting
Online Access:http://hdl.handle.net/1822/1639
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/1639

Internet

http://hdl.handle.net/1822/1639

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