Rheology of F620 solder paste and flux

Purpose The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of the solder paste. The data obtained experimentally are fundamental for the development of numerical models that...

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Detalhes bibliográficos
Autor principal: Barbosa, Flávia Vieira (author)
Outros Autores: Teixeira, José (author), Teixeira, Senhorinha F.C.F. (author), Lima, Rui Alberto Madeira Macedo (author), Soares, Delfim (author), Pinho, Diana (author)
Formato: article
Idioma:eng
Publicado em: 2019
Assuntos:
Rheology
Flux
Solder paste
Viscosity
Thixotropy
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Texto completo:http://hdl.handle.net/1822/73846
País:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/73846

Texto Completo

http://hdl.handle.net/1822/73846

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