Low-temperature thermal conductivity of highly porous copper

The development and characterization of new materials is of extreme importance in the design of cryogenic apparatus. Recently Versarien® PLC developed a technique capable of producing copper foam with controlled porosity and pore size. Such porous materials could be interesting for cryogenic heat ex...

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Detalhes bibliográficos
Autor principal: Tomás, G. (author)
Outros Autores: Martins, Daniel (author), Cooper, D. (author), Bonfait, G. (author)
Formato: conferenceObject
Idioma:eng
Publicado em: 2017
Assuntos:
Texto completo:https://doi.org/10.1088/1757-899X/101/1/012004
País:Portugal
Oai:oai:run.unl.pt:10362/21276