Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnec...

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Bibliographic Details
Main Author: Mendes, P. M. (author)
Other Authors: Polyakov, A. (author), Bartek, M. (author), Burghartz, J. N. (author), Correia, J. H. (author)
Format: conferencePaper
Language:eng
Published: 2003
Subjects:
On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
Online Access:http://hdl.handle.net/1822/1618
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/1618
Description
Summary:This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.

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