Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems
We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with...
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| Outros Autores: | , , |
| Formato: | conferencePaper |
| Idioma: | eng |
| Publicado em: |
2003
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| Assuntos: | |
| Texto completo: | http://hdl.handle.net/1822/1608 |
| País: | Portugal |
| Oai: | oai:repositorium.sdum.uminho.pt:1822/1608 |