Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems

We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with...

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Bibliographic Details
Main Author: Mendes, P. M. (author)
Other Authors: Bartek, M. (author), Burghartz, J. N. (author), Correia, J. H. (author)
Format: conferencePaper
Language:eng
Published: 2003
Subjects:
Chip size antenna
Antenna on glass
Antenna integration
Wireless microsystem
Online Access:http://hdl.handle.net/1822/1608
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/1608
Description
Summary:We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7x12.4 mm2 patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Corning Pyrex #7740 glass substrate is demonstrated.

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