DMAIC methodology to solder paste printing process in Printed Circuit Boards
Nowadays, production of defective items is a crucial issue for manufacturers. In repetitive and mature processes with low defect levels, measured by defects per million opportunities (DPMO), it is difficult to reduce them even further. The purpose of this study is to reduce the defects rate in one k...
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| Outros Autores: | , , |
| Formato: | article |
| Idioma: | eng |
| Publicado em: |
2017
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| Assuntos: | |
| Texto completo: | http://hdl.handle.net/1822/51963 |
| País: | Portugal |
| Oai: | oai:repositorium.sdum.uminho.pt:1822/51963 |