Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates
Room temperature and low temperature (120 degrees C) laser-assisted glass frit bonding of soda-lime glass substrates are accomplished in this work. The locally laser melted bonding showed hermeticity with helium leak rate of < 5 x 10(-8) atm cm(3) s(-1), maintaining its leak rate even after stand...
| Autor principal: | |
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| Outros Autores: | , , , |
| Formato: | article |
| Idioma: | eng |
| Publicado em: |
2017
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| Texto completo: | https://hdl.handle.net/10216/106958 |
| País: | Portugal |
| Oai: | oai:repositorio-aberto.up.pt:10216/106958 |