Creep behavior of a solder paste with BI addition

A common failure mode of electronic PCB’s is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB ass...

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Bibliographic Details
Main Author: Ribeiro, Pedro Emanuel Abreu (author)
Other Authors: Soares, Delfim (author), Cerqueira, M. F. (author), Teixeira, S. F. C. F. (author), Barros, Daniel Araújo (author), Teixeira, J. Carlos (author)
Format: conferencePaper
Language:eng
Published: 2018
Subjects:
SAC solder
Bismuth
Creep
Solder reliability
Solder mechanical properties
Engenharia e Tecnologia::Engenharia Mecânica
Science & Technology
Online Access:http://hdl.handle.net/1822/53400
Country:Portugal
Oai:oai:repositorium.sdum.uminho.pt:1822/53400

Internet

http://hdl.handle.net/1822/53400

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