APA (7th ed.) Citation

Ribeiro, P. E. A., Soares, D., Cerqueira, M. F., Teixeira, S. F. C. F., Barros, D. A., & Teixeira, J. C. (2018). Creep behavior of a solder paste with BI addition.

Chicago Style (17th ed.) Citation

Ribeiro, Pedro Emanuel Abreu, Delfim Soares, M. F. Cerqueira, S. F. C. F. Teixeira, Daniel Araújo Barros, and J. Carlos Teixeira. Creep Behavior of a Solder Paste with BI Addition. 2018.

MLA (8th ed.) Citation

Ribeiro, Pedro Emanuel Abreu, et al. Creep Behavior of a Solder Paste with BI Addition. 2018.